W66AP6NBQAHJ
W66AP6NBQAHJ
Part number:
256-W66AP6NBQAHJ-ND
Product_Category
Memory
Manufacturer
Winbond Electronics Corporation
Type
1GB LPDDR4, X16
Encapsulation
Package
Tray
RoHS:
YES
Quantity
150
$6.2100
Minimun: 1
multiples: 1
Quantity
Price
Total
1
$6.2100
$6.2100
10
$5.5800
$55.8000
25
$5.2700
$131.7500
80
$4.5700
$365.6000
230
$4.3300
$995.9000
440
$3.8900
$1,711.6000
945
$3.2800
$3,099.6000
2400
$3.1200
$7,488.0000
W66AP6NBQAHJ NEWS
Specifications
PDF1
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case200-TFBGA
Mounting TypeSurface Mount
Memory Size1Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency2.133 GHz
Memory FormatDRAM
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization64M x 16
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