SOIC-TDFN-8-A
SOIC-TDFN-8-A
Part number:
5335-SOIC-TDFN-8-A-ND
Product_Category
Adapter, Breakout Boards
Manufacturer
Chip-Bridge Technologies
Type
8-SOIC to 8-TDF
Encapsulation
Package
Bulk
RoHS:
NO
Quantity
1200
$16.5000
Minimun: 1
multiples: 1
Quantity
Price
Total
10
$16.5000
$165.0000
30
$12.5000
$375.0000
200
$10.0000
$2,000.0000
500
$9.0000
$4,500.0000
SOIC-TDFN-8-A NEWS
Specifications
PDF1
TYPEDESCRIPTION
MfrChip-Bridge Technologies
Series-
PackageBulk
Product StatusACTIVE
Size / Dimension0.331" L x 0.222" W (8.40mm x 5.64mm)
MaterialFR4 Epoxy Glass
Number of Positions8
Pitch0.050" (1.27mm)
Board Thickness0.031" (0.79mm) 1/32"
Proto Board TypeSMD to SMD
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