HDG200-DN-3
HDG200-DN-3
Part number:
HDG200-DN-3-ND
Product_Category
RF Transceiver ICs
Manufacturer
H&D Wireless
Type
IC RF TXRX+MCU
Encapsulation
Package
Tray
RoHS:
NO
Quantity
230
$35.6900
Minimun: 1
multiples: 1
Quantity
Price
Total
1
$35.6900
$35.6900
10
$32.9400
$329.4000
25
$30.2000
$755.0000
80
$27.9100
$2,232.8000
230
$26.5400
$6,104.2000
HDG200-DN-3 NEWS
Specifications
PDF1
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TYPEDESCRIPTION
MfrH&D Wireless
Series-
PackageTray
Product StatusACTIVE
Package / Case44-TQFN Exposed Pad Module
Mounting TypeSurface Mount
Frequency2.4GHz
Memory Size1kB EEPROM, 160kB SRAM
TypeTxRx + MCU
Operating Temperature-40°C ~ 85°C
Voltage - Supply2.75V ~ 3.6V
Power - Output17dBm
Protocol802.11b/g/n
Current - Receiving49mA
Data Rate (Max)72.2Mbps
Current - Transmitting197mA
Supplier Device Package44-QFN SIP (8x8)
RF Family/StandardWiFi
Serial InterfacesSDIO, SPI
DigiKey ProgrammableNot Verified
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