Mfr | Aries Electronics, Inc. |
Series | Lo-PRO®file, 526 |
Package | Bulk |
Product Status | ACTIVE |
Features | Closed Frame |
Mounting Type | Through Hole |
Type | DIP, ZIF (ZIP) |
Operating Temperature | -55°C ~ 105°C |
Number of Positions or Pins (Grid) | 40 (2 x 20) |
Termination | Solder |
Material Flammability Rating | UL94 V-0 |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Tin |
Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
Contact Material - Mating | Beryllium Copper |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin |
Contact Finish Thickness - Post | 10.0µin (0.25µm) |
Contact Material - Post | Beryllium Copper |
Termination Post Length | 0.105" (2.67mm) |
Current Rating (Amps) | 3 A |