W66BQ2NQQAFJ
W66BQ2NQQAFJ
Part number:
256-W66BQ2NQQAFJ-ND
Product_Category
Memory
Manufacturer
Winbond Electronics Corporation
Type
2GB LPDDR4X, DD
Encapsulation
Package
Tray
RoHS:
YES
Quantity
150
$6.7300
Minimun: 1
multiples: 1
Quantity
Price
Total
1
$6.7300
$6.7300
10
$6.0800
$60.8000
25
$5.8000
$145.0000
80
$5.0300
$402.4000
230
$4.8100
$1,106.3000
440
$4.3800
$1,927.2000
945
$3.8200
$3,609.9000
2400
$3.6800
$8,832.0000
W66BQ2NQQAFJ NEWS
Specifications
PDF1
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case200-TFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4X
Clock Frequency1.6 GHz
Memory FormatDRAM
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_06
Access Time3.6 ns
Memory Organization64M x 32
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