W66BP6NBQAFJ
W66BP6NBQAFJ
Part number:
256-W66BP6NBQAFJ-ND
Product_Category
Memory
Manufacturer
Winbond Electronics Corporation
Type
2GB LPDDR4, X16
Encapsulation
Package
Tray
RoHS:
YES
Quantity
150
$6.2300
Minimun: 1
multiples: 1
Quantity
Price
Total
1
$6.2300
$6.2300
10
$5.6200
$56.2000
25
$5.3600
$134.0000
80
$4.6600
$372.8000
230
$4.4500
$1,023.5000
440
$4.0500
$1,782.0000
945
$3.5300
$3,335.8500
2400
$3.4000
$8,160.0000
W66BP6NBQAFJ NEWS
Specifications
PDF1
TYPEDESCRIPTION
MfrWinbond Electronics Corporation
Series-
PackageTray
Product StatusACTIVE
Package / Case200-TFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency1.6 GHz
Memory FormatDRAM
Supplier Device Package200-TFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.6 ns
Memory Organization128M x 16
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